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Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470

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Set Alert for Product: MINISFORUM AI X1 Pro-470 Mini PC AMD Ryzen AI 9 HX 470(12C/24T) Barebone Without Storage/OS Desktop Computer, HDMI|DP|2xUSB4 Output, 2xRJ45 Port, WiFi7, BT5.4, AMD Radeon 890M Graphics - $759.90

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Processor9.3
RAM9
Hard Disk9.5
Connectivity9.5

AMD Ryzen™ AI 9 HX 470 (Gorgon Point) AI Mini PC — world’s first with this processor. 12 Zen 5 / Zen 5c cores / 24 threads up to 5.2 GHz. AMD Radeon™ 890M — 16 RDNA 3.5 CUs. XDNA 2 NPU — 55 TOPS. 86 TOPS total AI performance. Copilot+ PC certified. Up to 128 GB DDR5 SO-DIMM UPGRADEABLE (2 slots). Triple M.2 PCIe 4.0 (up to 12 TB). OCuLink PCIe 4.0 ×4 for eGPU. Dual 2.5 GbE. Dual USB4. HDMI 2.1 + DP 2.0. Wi-Fi 7. Integrated PSU. Fingerprint reader. Built-in dual DMIC + speaker. Kensington lock.

Last updated on September 11, 2026 11:18 am
Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470
Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470

Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 Prices

$759.90
September 11, 2026 11:18 am
× Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon.com (Amazon.in, Amazon.co.uk, Amazon.de, etc) at the time of purchase will apply to the purchase of this product.
$1,302.49
September 11, 2026 11:18 am
× Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon.com (Amazon.in, Amazon.co.uk, Amazon.de, etc) at the time of purchase will apply to the purchase of this product.

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Description

Minisforum AI X1 Pro-470

World’s First AMD Ryzen™ AI 9 HX 470 Mini PC — Gorgon Point

The Minisforum AI X1 Pro-470 is the world’s first mini PC powered by AMD’s Ryzen AI 9 HX 470 processor, unveiled at CES 2026 and positioned as the definitive compact platform for on-device AI, creative workloads, and gaming. It builds on the already exceptional AI X1 Pro foundation — itself reviewed by PCWorld as one of the most versatile and powerful mini PCs available today — and elevates every key metric: a faster NPU delivering 55 TOPS, a higher CPU boost frequency of 5.2 GHz, and the same exceptional expandability that made its predecessor stand out, including three M.2 PCIe 4.0 SSD slots, two DDR5 SO-DIMM slots, and a full OCuLink port for external GPU docks. Add an integrated power supply unit, a fingerprint reader, built-in dual DMIC microphones, an integrated speaker, and dual 2.5 GbE networking, and you have a machine that challenges the logic of owning a full-size desktop.

Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pc

AMD Ryzen™ AI 9 HX 470 — Gorgon Point, the Next Step in Zen 5

The Ryzen AI 9 HX 470 is AMD’s second-generation Strix architecture processor under the “Gorgon Point” designation, manufactured on TSMC’s 4 nm process node. Architecturally similar to the Strix Point HX 370, the HX 470 brings meaningful improvements: the NPU has been upgraded to XDNA 2.1 with 55 peak TOPS (compared to 50 on the HX 370), and the CPU maximum boost frequency reaches 5.2 GHz, 100 MHz higher than its predecessor. The chip retains the same 12-core, 24-thread hybrid design combining four full Zen 5 performance cores with eight efficiency-optimised Zen 5c cores, all operating within the same 28W to 54W configurable TDP window. Combined AI performance across CPU, GPU, and NPU reaches 86 TOPS total — placing the AI X1 Pro-470 well above the 40 TOPS Copilot+ PC certification threshold and matching or exceeding every other mini PC in its class at launch.

  • 12 cores / 24 threads (4× Zen 5 P-cores + 8× Zen 5c E-cores)
  • Base 2.0 GHz — Boost up to 5.2 GHz
  • L2 Cache: 24 MB | L3 Cache: 24 MB
  • 4 nm TSMC process node (Gorgon Point)
  • TDP: 28W base / up to 54W configurable
  • Unveiled at CES 2026 — available from February 2026

 

AMD Radeon™ 890M — 16 RDNA 3.5 CUs with Up to 48 GB Configurable VRAM

The integrated Radeon 890M GPU features 16 RDNA 3.5 compute units running at up to 2.9 GHz, making it the most capable integrated GPU on the Gorgon Point platform. Through the BIOS, users can allocate between 2 GB and 48 GB of system DDR5 RAM as dedicated VRAM — a range that covers everything from basic desktop use to serious AI inference with large vision models and local Stable Diffusion generation. In gaming benchmarks at 1080p with FidelityFX Super Resolution (FSR) enabled, the 890M delivers smooth and playable frame rates across a broad catalogue of titles. In independent benchmark testing, the AI X1 Pro-470 surpasses Apple’s M1 Max in single-core performance — a meaningful comparison that illustrates how competitive this integrated architecture has become. GPU temperature under sustained load peaks at approximately 73°C with no thermal throttling observed, thanks to the system’s dedicated active cooling.

XDNA 2 NPU — 55 TOPS of Dedicated AI Acceleration

The HX 470’s XDNA 2 NPU delivers 55 peak TOPS — 10% more than the HX 370’s 50 TOPS — and operates independently of the CPU and GPU, offloading AI inference tasks without impacting general computing performance. This NPU supports INT4, INT8, INT16, FP16, BF16, and TF32 precision formats, covering the full range of quantised and floating-point operations used by modern language models and diffusion networks. When combined with the CPU’s 20 TOPS and the GPU’s 12 TOPS, total system AI throughput reaches 86 TOPS. The AI X1 Pro-470 is a certified Microsoft Copilot+ PC, enabling Windows 11 AI features including Recall, live caption translation, generative image tools, and studio audio effects — all running locally on the XDNA 2 NPU without cloud dependency. For more demanding AI workloads such as running LLaMA 3, Mistral, or Phi-3 models via LM Studio or Ollama, 64 GB of RAM is recommended for optimal token generation speeds.

Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pc

Up to 128 GB DDR5 — Two SO-DIMM Slots, Fully User-Upgradeable

Like the GEEKOM A9 Max and unlike the soldered-memory GMKtec EVO-X2, the Minisforum AI X1 Pro-470 uses two standard DDR5 SO-DIMM slots supporting speeds up to 5600 MHz and capacities up to 64 GB per slot, for a maximum of 128 GB total. The base pre-configured model ships with 32 GB (2×16 GB dual-channel), with 64 GB and 96 GB options also available. Users who purchase the barebone configuration can install their own DDR5 SO-DIMM modules without any soldering or specialist tools. The dual-channel architecture ensures the Radeon 890M receives sufficient memory bandwidth for graphics workloads, though independent reviews note that the DDR5-5600 speed is a slight bottleneck compared to LPDDR5X-8000 systems like the EVO-X2 for pure GPU tasks. This is a reasonable trade-off given the significant upgrade flexibility the SO-DIMM format provides.

  • 2× DDR5 SO-DIMM slots — fully user-accessible
  • Standard config: 32 GB DDR5-5600 (2×16 GB dual-channel)
  • Maximum supported: 128 GB (2×64 GB DDR5 SO-DIMM)
  • VRAM allocatable: 2 GB – 48 GB via BIOS settings
  • 64 GB recommended for demanding local AI model inference

Triple M.2 PCIe 4.0 SSD Slots — Up to 12 TB of NVMe Storage

The AI X1 Pro-470 provides three M.2 2280 NVMe slots — more than any other mini PC in its category. All three accept PCIe 4.0 drives, though with different bandwidth configurations: the two primary slots (SSD0 and SSD1) operate at full PCIe 4.0 ×4 with sequential read speeds of 6,700–7,300 MB/s, while the third slot (SSD2) runs at PCIe 4.0 ×1 for sequential reads of 1,500–1,900 MB/s, suitable for secondary storage or less latency-sensitive workloads. Each slot supports drives up to 4 TB, giving a theoretical maximum of 12 TB of NVMe storage in a chassis under two litres. The bottom access panel is secured with four screws and provides simultaneous access to all three SSD slots and both DIMM slots, making the upgrade process entirely practical for non-specialist users.

Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pc Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pc

OCuLink PCIe 4.0 ×4 — eGPU Support for Full Desktop Graphics

One of the most distinctive features of the AI X1 Pro-470 is its OCuLink port, which provides a full PCIe 4.0 ×4 connection at 63 Gbps — enough bandwidth to connect an external GPU enclosure with near-native performance. Unlike Thunderbolt-based eGPU connections, which introduce overhead from protocol conversion, OCuLink delivers raw PCIe bandwidth with minimal latency penalty, making it a genuine upgrade path for users who need discrete GPU performance for tasks such as 4K/8K video rendering, CAD modelling, or high-framerate gaming. Compatible enclosures such as the Minisforum DEG2 allow connection of full-length NVIDIA RTX or AMD Radeon RX series cards, turning the AI X1 Pro-470 into a compact but fully capable gaming workstation when needed, while maintaining its quiet and compact everyday profile without the external GPU attached.

Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pc Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pc Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pc

Integrated Power Supply — No External Brick

Unlike most mini PCs in this performance tier, the AI X1 Pro-470 incorporates an internal power supply unit rather than an external power brick. This design decision keeps the desk setup clean, eliminates the bulky adapter that typically accompanies competing systems, and simplifies cable management significantly. Power draw at idle sits around 9W, rising to a peak of approximately 96W under sustained full load — efficient figures for a 54W-TDP platform with active cooling. The internal PSU handles the full power envelope without thermal compromise.

Dual 2.5 GbE + Wi-Fi 7 + Bluetooth 5.4 — Comprehensive Networking

Wired connectivity is handled by two independent 2.5 Gigabit Ethernet ports, enabling simultaneous connection to two separate networks — for example, a primary router and a dedicated NAS or lab environment — without requiring an external switch or USB adapter. Wireless networking is covered by a Wi-Fi 7 (802.11be) module with Bluetooth 5.4, delivering multi-link operation and significantly higher throughput than Wi-Fi 6E. Wake-on-LAN is supported for remote management scenarios. This combination of dual 2.5 GbE and Wi-Fi 7 puts the AI X1 Pro-470 among the best-connected mini PCs available regardless of price point.

 

Fingerprint Reader + Built-in Dual DMIC + Speaker

The AI X1 Pro-470 includes a fingerprint recognition sensor on the top surface supporting Windows Hello biometric login — a feature rarely found in mini PCs and more commonly associated with premium laptops. For communication, the system integrates a dual DMIC microphone array with AI-powered noise cancellation that isolates speech from background noise during video calls and voice-activated AI interactions, paired with a built-in speaker for audio output without requiring external peripherals. These features make the AI X1 Pro-470 genuinely self-contained for video conferencing, AI assistant interaction, and general productivity — no USB microphone or webcam speaker required.

Display Output — Quad Screens up to 8K

The AI X1 Pro-470 drives up to four independent displays simultaneously through its combination of HDMI 2.1 FRL (8K@60Hz), DisplayPort 2.0 (capable of 16K tunnelling or 8K@60Hz natively), and two USB4 ports with DisplayPort 1.4 Alt Mode. This output configuration covers virtually every professional multi-monitor scenario, from a dual-4K video editing suite to a four-screen trading workstation, and is future-proofed for 8K displays becoming mainstream over the product’s usable lifespan.

Build Quality — Compact, Secure, and Thoughtfully Designed

The AI X1 Pro-470 chassis measures 195 × 195 × 47.5 mm and weighs approximately 1.5 kg, with a metal construction that feels substantially more premium than typical plastic mini PC enclosures. The heavier weight compared to competitors like the GEEKOM A9 Max is a direct consequence of the integrated PSU and the more robust thermal module needed to cool the 54W platform without an external brick. A Kensington lock slot on the rear panel provides physical security for shared office and lab environments. Power consumption efficiency — ranging from 9W idle to 96W peak — is competitive for the performance tier. Cooling is managed by an active fan system with BIOS-configurable fan speed curves, keeping peak CPU temperatures around 73°C under sustained load in independent testing, with no thermal throttling observed during multi-hour stress tests.

Complete Port Layout

Front: 2× USB-A 3.2 Gen2 (10 Gbps) · 1× USB4 (40 Gbps, PD-in 65–100W / PD-out 15W / DP1.4 / Data) · 1× SD card reader · 1× 3.5mm combo audio jack · Power button · Fingerprint sensor (top panel)

Rear: 1× HDMI 2.1 FRL (8K@60Hz) · 1× DisplayPort 2.0 (8K@60Hz) · 1× USB4 (40 Gbps, DP1.4 / Data) · 1× USB-A 2.0 · 2× RJ45 2.5 Gigabit Ethernet · 1× OCuLink (PCIe 4.0 ×4, 63 Gbps) · 1× CLR CMOS button · 1× Kensington lock slot · 1× Internal power input

Windows 11 Pro + Copilot+ AI Features from Day One

The pre-configured AI X1 Pro-470 ships with Windows 11 Pro installed and activated, with all Copilot+ AI features active from first boot — including Recall, live captions, AI image creation, and voice-powered Copilot interaction. All of these features run locally on the XDNA 2 NPU without cloud latency or subscription requirements. Linux and Ubuntu are also officially supported for users who prefer an open-source environment. A barebone version is available for those who wish to install their own operating system and memory/storage configuration.

Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pc Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pc Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pc Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pcMinisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pc Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pcMinisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470 mini pc

Video

9.3Expert Score
AMD Ryzen™ AI 9 HX 470 (Gorgon Point) AI Mini PC — world's first with this processor. 12 Zen 5 / Zen 5c cores / 24 threads up to 5.2 GHz. AMD Radeon™ 890M — 16 RDNA 3.5 CUs. XDNA 2 NPU — 55 TOPS. 86 TOPS total AI performance. Copilot+ PC certified. Up to 128 GB DDR5 SO-DIMM UPGRADEABLE (2 slots). Triple M.2 PCIe 4.0 (up to 12 TB). OCuLink PCIe 4.0 ×4 for eGPU. Dual 2.5 GbE. Dual USB4. HDMI 2.1 + DP 2.0. Wi-Fi 7. Integrated PSU. Fingerprint reader. Built-in dual DMIC + speaker. Kensington lock.
Processor
9.3
RAM
9
Hard Disk
9.5
Connectivity
9.5
PROS
  • AMD Ryzen™ AI 9 HX 470 (Gorgon Point) — world's first mini PC with this processor|AMD Radeon™ 890M — 16 RDNA 3.5 CUs, up to 48 GB VRAM via BIOS|XDNA 2 NPU — 55 TOPS dedicated AI / 86 TOPS total|Copilot+ PC certified — all Windows 11 AI features enabled|Up to 128 GB DDR5 SO-DIMM — FULLY USER-UPGRADEABLE (2 slots)|Triple M.2 PCIe 4.0 slots — up to 12 TB total NVMe storage|OCuLink PCIe 4.0 ×4 (63 Gbps) — eGPU support for discrete GPU performance|Dual 2.5 GbE Ethernet — dual independent wired networks|Dual USB4 (40 Gbps) — front and rear|HDMI 2.1 + DisplayPort 2.0 + 2× USB4 — quad 8K display support|Wi-Fi 7 + Bluetooth 5.4|Integrated PSU — no external power brick|Fingerprint reader — Windows Hello biometric login|Built-in dual DMIC (AI noise cancellation) + integrated speaker|Kensington lock slot

Additional information

Specification: Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470

Configuration Options
Storage Options

1 TB | 2 TB | Barebone (no storage)

RAM Options

32 GB | 64 GB | 96 GB | 128 GB | Barebone (no RAM)

AI Capabilities
NPU

AMD XDNA 2 — 55 peak TOPS (INT4/INT8/INT16/FP16/BF16/TF32)

NPU Architecture

XDNA 2

Combined Power (CPU + GPU + NPU)

86 TOPS total AI performance (55 NPU + 20 CPU + 12 GPU)

Microsoft Copilot Compliance

exceeds 40 TOPS requirement), Yes — Copilot+ PC certified (86 TOPS

Processor
Processor Brand

AMD

CPU Model

AMD Ryzen™ AI 9 HX 470 (Gorgon Poing – Zen 5)

CPU Speed

2.0 GHz (up to 5.2 GHz)

Processor Cache

48 MB (L2: 24 MB + L3: 24 MB)

Processor Cores / Threads

12 Cores / 24 Threads (4× Zen 5 P-cores + 8× Zen 5c E-cores)

Processor Nanometer

4 nm

Processor Launch Date

January 2026 (CES 2026 — Gorgon Point)

TDP

28W base / up to 54W configurable

Ports
HDMI

1× HDMI 2.1 FRL 8K@60Hz (rear)

DisplayPort

1× DisplayPort 2.0 8K@60Hz (rear)

USB 2.0 Ports

1× USB-A 2.0 (rear)

USB 3.0 Ports

2× USB-A 3.2 Gen2 (10 Gbps) — front

USB 4.0 Ports

2× USB4 40Gbps — 1× front (PD-in 65–100W / PD-out 15W / DP1.4 / Data) · 1× rear (DP1.4 / Data)

RJ45

2× 2.5 Gigabit Ethernet (2500 Mbps) — dual independent ports (rear)

Speaker

Yes — built-in integrated speaker

Audio Output

1× 3.5mm combo audio jack (front)

Microphone (Built-in)

2× DMIC with AI-powered noise cancellation (dual microphone array)

Fingerprint Recognition

Windows Hello biometric login, Yes — fingerprint sensor on top panel

CLR CMOS Button

Yes — rear panel

Copilot Button

Yes — dedicated Copilot button on front panel

Network
Bluetooth

5.4

Ethernet

2× 2.5 Gigabit Ethernet — connect two separate wired networks simultaneously

Wi-Fi

Wi-Fi 7 (802.11be)

GPU
Graphics Coprocessor

AMD Radeon™ 890M (integrated, RDNA 3.5)

Graphics Description

2 GB–48 GB configurable VRAM via BIOS, AMD Radeon 890M — 16 RDNA 3.5 Compute Units up to 2.9 GHz

Video Resolution

8K@60Hz (7680×4320)

Graphics Core

16 Compute Units (RDNA 3.5)

Graphics Frequency

Up to 2.9 GHz

Video Output

1× HDMI 2.1 FRL (8K@60Hz)|1× DisplayPort 2.0 (8K@60Hz)|2× USB4 with DP 1.4 (8K@60Hz) — Quad display support

Architecture GPU

RDNA 3.5

Internal Ports
M.2

3× M.2 2280 PCIe 4.0 NVMe slots — SSD0/SSD1: ×4 full speed · SSD2: ×1 secondary

Storage & RAM
Hard Disk Size

1 TB PCIe 4.0 NVMe SSD (base pre-configured)

Hard Drive Interface

SSD0+SSD1: M.2 2280 PCIe 4.0 ×4 (6700–7300 MB/s) · SSD2: M.2 2280 PCIe 4.0 ×1 (1500–1900 MB/s)

Hard Drive Upgrade Storage

Up to 12 TB total across 3× M.2 2280 PCIe 4.0 slots (up to 4 TB per slot)

RAM Size

32 GB (base pre-configured)

RAM Type

DDR5 SO-DIMM 5600 MHz — FULLY USER-UPGRADEABLE (NOT soldered)

Supported RAM

128 GB maximum (2× 64 GB DDR5 SO-DIMM modules)

RAM Interface

DDR5-5600 Dual Channel — 2× SO-DIMM slots, user-accessible

Power
Consumes Power

9W idle / 96W peak (28W–54W configurable TDP)

Power Adapter

Integrated internal PSU — no external power brick required

Others Specifications
Brand

Minisforum

Model

AI X1 Pro-470

Launch Date

February 2026

O.S.

Windows 11 Pro (pre-installed and activated) — Barebone option also available

Other S.O. Supported

Linux / Ubuntu

WOL

Yes — Wake-on-LAN supported

Design

Metal chassis — black finish. 195 × 195 × 47.5 mm. Integrated PSU design.

Ventilation

Active cooling — single blower fan with configurable BIOS fan speed curves. Peak CPU temp ~73°C under sustained load. Idle: ~9W / Peak: ~96W

Kensington lock

rear panel, Yes — Kensington lock slot

Mounting

No VESA mount included

Product Dimensions

195 × 195 × 47.5 mm

Net Weight

~1.5 kg (integrated PSU included)

Package

1× Minisforum AI X1 Pro-470 · 1× Power Cable (IEC) · 1× HDMI Cable · 1× User Manual

Specification
SD Card slot

1× SD card reader (front panel)

Power Source

Internal PSU (integrated) — standard IEC power cable

VESA Support

No

Videos

Videos: Minisforum AI X1 Pro-470 AMD Ryzen™ AI 9 HX 470

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